Conn-Link Technology Inc
Description
  • USB2.0 Micro AB
  • 5P
  • Receptacle
  • Right Angle
  • SMD
  • Gold Flash
  • Reversed Type
  • Black Color
  • With DIP Shielding(Matte-Tin)
  • T&R Package

Material

  • Housing: High Temperature Thermoplastic+G.F, UL 94V-0 Rated.
  • Color: Black.
  • Contact: Copper Alloy, T=0.15mm.
  • Plating: Gold Plating over Nickel on Contact Area,
    Tin Plating on Solder Tail.
  • Shield: Stainless Steel (SUS).
  • Plating: Nickel Plating.

Mechanical

  • Insertion Force: 3.57Kgf Max.
  • Withdrawal Force: 1.0Kgf Min Initial, 0.81~2.05Kgf after 10,000Cycles.
  • Durability: 10,000Cycles.

Electrical Specification

  • Current Rating: 1.0Ampere at 30VDC.
  • Contact Resistance: 30mΩ Max Initial, 40mΩ after 1000Cycles.
  • Insulation Resistance: 100MΩ Min.
  • Dielectric Withstanding Voltage: 100 VAC per Minute.

Environmental

  • Operating Temperature: -30°C to +80°C
  • RoHS Compliance.