Conn-Link Technology Inc

CNSM-H08VSG0-B03

Description

  • Nano SIM Card Socket Connector
  • Hinge Type
  • Pitch 0.90mm
  • 8Pins
  • Gold Flash
  • SMD
  • H=1.40mm Height
  • Without Post
  • With Matel Shell
  • High Temperature Thermoplastic
  • Black Color

Nano SIM Card Socket, 8Pins, Hinge Type, Pitch 0.90mm, H=1.40mm, Without Posts, With Metal Shell, Gold Flash, Black Color

Material

  • Housing: High Temperature Thermoplastic, UL 94V-0 Rated.
  • Color: Black.
  • Contact: Copper Alloy.
  • Plating: Gold Plating on Contact Area;
  • Gold Flash Plating on Solder Area.
  • Nickel 50u" Min. Under Plating Over All.
  • Shell: Stainless Steel.
  • Plating: Gold Flash Plating on Solder Area;
  • Nickel 50u" Min. Plating Over All.

Mechanical

  • Insertion Force: 10N Max.
  • Withdrawal Force: 0.5N Min.
  • Life Cycles: 5,000Cycles.

Electrical Specification

  • Voltage Rating: 30V AC RMS.
  • Current Rating: 0.5 Ampere AC RMS Max.
  • Contact Resistance: 100mΩ Max.
  • Insulation Resistance: 1000MΩ Min 500V DC.
  • Dielectric Withstanding Voltage: 500V AC per Minute.

Environmental

  • Operating Temperature: -20°C to +80°C.
  • Soldering Temperature: +250°C±5°C.
  • RoHS Compliance.
  • REACH Compliance.