凱聯科技股份有限公司
Description
  • USB2.0 Micro B Type
  • 5Pins Receptacle
  • Right Angle
  • SMD Type
  • Black Color
  • With SMT Shielding
  • With 2Posts 4.0mm
  • Gold Flash Plating

Material

  • Housing: High Temperature Thermoplastic with G.F., UL94 V-0.
  • Color: Black.
  • Contact: Copper Alloy, T=0.20mm.
  • Plating: Gold Plating over Nickel(50u") on Contact Area,
    Tin(80u"~100u") Plating over Nickel(50u") on Solder Tail.
  • Shield: Copper Alloy, T=0.25mm.
  • Plating: Nickel(100u"~120u") Plating.

Mechanical

  • Insertion Force: 3.57Kgf Max.
  • Withdrawal Force: 1.0Kgf Min Initial, 0.81~2.05Kgf after 10000Cycles.
  • Durability: 10000Cycles.

Electrical Specification

  • Current Rating: 1.0Ampere at 30VDC.
  • Contact Resistance: 30mΩ Max Initial, 50mΩ after 1000Cycles.
  • Insulation Resistance: 100MΩ Min.
  • Dielectric Withstanding Voltage: 100 VAC per Minute.

Environmental

  • Operating Temperature: -30°C to +80°C
  • RoHS Compliance.