凱聯科技股份有限公司
Description
  • Wire to Board
  • 2.50mm Pitch Crimp Style Wafer
  • Vertical
  • DIP
  • 02~20Pins
  • White Color

Material

  • Housing: Nylon 66, UL 94V-2 Rated.
  • Color: White.
  • Contact: Brass.
  • Plating: Tin Plating over Nickel.
    Tin Plating on Solder Tail.

Electrical Specification

  • Operation Voltage: 125V AC/DC.
  • Current Rating: 3 Ampere AC/DC per Contact.
  • Contact Resistance: 20mΩ Max.
  • Insulation Resistance: 1000MΩ Min.
  • Dielectric Withstanding Voltage: 1000V AC per Minute.

Environmental

  • Operating Temperature: -25°C to +85°C.
  • Package: 1,000pcs/Bag.
  • RoHS Compliance.