凱聯科技股份有限公司

Description

  • ATX3.1 H++
  • PCI Express 6.0
  • 12V-2x6 Auxiliary Power
  • 3.0mm 2x6Pins with 2.0mm 4Pins
  • Male Type
  • Vertical Type
  • DIP D=3.4mm
  • H=12.80mm
  • Engineer Thermoplastic
  • Black Color

ATX3.1 H++ PCI Express 6.0 12V-2x6 Auxiliary Power, 3.0mm 2x6Pins with 2.0mm 4Pins, Male Type, Vertical, DIP D=3.4mm, H=12.80mm, Thermoplastic, Black Color

Material

  • Housing: Engineer Thermoplastic, UL 94V-0 Rated.
  • Color: Black Color.
  • Power and GND Contacts: Copper Alloy.
  • Plating: 80u" Min. Tin Plating Over All;
  • 30u" Min. Nickel Under Plating Over All.
  • Signal Contacts: Copper Alloy.
  • Plating: 80u" Min. Tin Plating Over All;
  • 30u" Min. Nickel Under Plating Over All.
  • Board Lock: Stainless Steel.
  • Plating: 80u" Min. Tin Plating Over All;
  • 30u" Min. Nickel Under Plating Over All.

Electrical Specification

  • Current Rating:
  • 9.2A per Pin (Power & GND Pins);
  • 1.0A per Pin (Signal Pins).
  • Voltage Rating: 12V DC.
  • Contact Resistance:
  • 6mΩ Max Initial(Power & GND Pins);
  • 10mΩ Max Initial(Signal Pins).
  • Insulation Resistance: 1000MΩ Min at 500V DC.
  • Dielectric Withstanding Voltage:
  • 1500V AC R.M.S for One Minute(Power & GND Pins).
  • 500V AC R.M.S for One Minute(Signal Pins).

Environmental

  • Operating Temperature:  -40°C to +105°C.
  • Resistance to Soldering Heat: 260°C for 10 Seconds.
  • RoHS Compliance.
  • REACH Compliance.